Intel news roundup: chiplets milestone, server exit, and ARM deal
Three announcements from Intel pertain to chip manufacturing and divesting its prebuilt server business.
Intel has had a busy week with several significant announcements. The first news was that the company has started shipping prototype multi-die chips to the US Department of Defense, which is part of a project called State-of-the-Art Heterogeneous Integrated Packaging. The DoD project aims to connect Intel’s CPUs, FPGAs, ASICs, and government-developed chiplets within the same processor packaging, making manufacturing more manageable. Intel’s chip design is different from AMD’s, which broke up large, monolithic CPUs into smaller chips. Intel mixes multiple chip designs, including some from the federal government, which may contain sensitive military IP.
Another piece of news is that Intel and Arm have signed an agreement to help Arm licensees manufacture their products at an Intel fab using an upcoming advanced production node. This is a big win for Intel, which announced its IDM 2.0 strategy two years ago but hasn’t landed any big names. The deal will help chip designers manufacture chips using Intel’s 18A process node and will focus on mobile SoC designs initially.
Finally, Intel has sold its server business to MiTAC, a Taiwanese electronics manufacturer and parent company of Tyan, a maker of server components and servers. The sale is in line with Intel’s continued efforts to prioritize investments in its IDM 2.0 strategy. The company has made a number of product cuts in recent years, including the elimination of its Optane persistent memory technology.